Document Type
Article
Publication Date
6-20-2012
Abstract
We have previously derived seven requirements for the formulation of effective stain etchants and have demonstrated that Fe3+, Ce4+, and VO2 (+) + HF solutions are highly effective at producing nanocrystalline porous silicon. Here, we show that Cl-2, Br-2, I-2, ClO3 (-), BrO3 (-), IO3 (-), I-, and I-3 (-) induce etching of silicon when added to HF. However, using the strict definition that a pore is deeper than it is wide, we observe little evidence for porous layers of significant thickness but facile formation of pits. Iodate solutions are extremely reactive, and by the combined effects of IO3 (-), I-3 (-), I-2, and I-, these etchants roughen and restructure the substrate to form a variety of structures including (circular, rectangular, or triangular) pits, pyramids, or combinations of pits and pyramids without leaving a porous silicon layer of significant thickness.
Publication Title
Nanoscale Research Letters
ISSN
1931-7573
Publisher
SpringerOpen
Volume
7
DOI
10.1186/1556-276X-7-323
Recommended Citation
Kolasinski, K., & Gogola, J. W. (2012). Electroless Etching of Si with IO-3 and Related Species. Nanoscale Research Letters, 7 http://dx.doi.org/10.1186/1556-276X-7-323
Comments
Publisher's version at http://www.nanoscalereslett.com/content/7/1/323